Polish physics simulation
Models pressure distribution, removal rate and pad wear to predict within-wafer removal uniformity.
Benchmark architecture
CMP
CMP equipment
Chemical Mechanical Polishing
The planarization area that holds stack flatness and thinning quality.
EQUIPMENT SCOPE
Equipment scope
- EBARA CMP polishing equipment
- ACCRETECH CMP and wafer processing equipment
Focused on leading Japanese brands, covering planarization polish and wafer thinning equipment.
SERVICES
Services provided
- Equipment procurement, evaluation and tool selection
- Tool condition inspection and acceptance support
- De-installation, packing and cross-border shipping
- Move-in installation, water and drain hookup, and tuning
- Polishing head, pad and consumables maintenance planning
- Planarization process condition setup
- Operator and maintenance staff training
AI INTEGRATION
AI integration
The third-party frontier architectures BETTER benchmarks and deploys.
PDF Exensio (2025) XGBoost + PCA
Combines defect, metrology, electrical test and FDC data to predict die and wafer yield.
Benchmark architecture
TSMC smart manufacturing: RNN time-series FDC
Polisher sensor time series reveal abnormal trends and the factors that drive yield loss.
Benchmark architecture
USE CASES
Where it fits
- Multilevel metal interconnect needing tight flatness control
- Wafer thinning demand from advanced packaging
- CMP tool relocation and water line rebuild
- Research institutes building planarization capability
GET IN TOUCH
Let's talk about your line
One point of contact from equipment selection through installation and AI integration.