DeepOHeat-v1 (2025)
A physics-informed thermal surrogate model quickly predicts hot plate and wafer temperature fields.
Benchmark architecture
THERMAL / BAKE
Thermal / Bake
Thermal processing that manages thermal budget and batch consistency.
EQUIPMENT SCOPE
Focused on leading Japanese brands, covering hot plate modules and batch thermal equipment.
SERVICES
AI INTEGRATION
The third-party frontier architectures BETTER benchmarks and deploys.
DeepOHeat-v1 (2025)
A physics-informed thermal surrogate model quickly predicts hot plate and wafer temperature fields.
Benchmark architecture
ThermEDGe / IREDGe
Time-varying power and heating distribution predict temperature contours and locate thermal non-uniformity.
Benchmark architecture
Batch thermal process digital twin
Simulates batch ramp profiles and wafer boat position differences to optimize thermal budget allocation.
Benchmark architecture
USE CASES
GET IN TOUCH
One point of contact from equipment selection through installation and AI integration.