IBM ASMC (2025) ViT (DINOv2) + semi-supervised
Few-shot learning classifies SEM images of particle and residue defects.
Benchmark architecture
WAFER CLEANING
Wafer clean & dry equipment
Wafer Cleaning
The area that suppresses particles and chemical residue to protect yield.
EQUIPMENT SCOPE
Equipment scope
- DNS wafer cleaning equipment
- TEL wafer cleaning equipment
Focused on leading Japanese brands, covering single-wafer and batch cleaning and drying equipment.
SERVICES
Services provided
- Equipment procurement, evaluation and tool selection
- Tool condition inspection and acceptance support
- De-installation, packing and cross-border shipping
- Move-in installation, chemical supply and drain hookup, and tuning
- Chemical delivery system and nozzle maintenance
- Cleaning process condition setup
- Operator and maintenance staff training
AI INTEGRATION
AI integration
The third-party frontier architectures BETTER benchmarks and deploys.
TSMC smart manufacturing: RNN time-series FDC
Cleaner sensor time series reveal chemistry and flow anomalies as they develop.
Benchmark architecture
Particle defect root cause analysis
Inspection and tool data are linked to trace particle sources back to cleaning conditions.
Benchmark architecture
USE CASES
Where it fits
- Advanced-node lines under particle yield pressure
- Projects strengthening cleaning between front and back end
- Cleaning tool relocation and chemical system rebuild
- Research institutes building cleaning and surface treatment capability
GET IN TOUCH
Let's talk about your line
One point of contact from equipment selection through installation and AI integration.