Plasma physics simulation and chamber digital twin
Physics models predict plasma distribution and etch rate, so conditions are validated in a virtual chamber first.
Benchmark architecture
ETCH
Dry & plasma etch equipment
Etch
The critical area for feature dimensions and sidewall profile.
EQUIPMENT SCOPE
Equipment scope
- TEL semiconductor etch equipment
- SAMCO semiconductor etch equipment
Focused on leading Japanese brands, covering dry etch and plasma etch tool configurations.
SERVICES
Services provided
- Equipment procurement, evaluation and tool selection
- Tool condition inspection and acceptance support
- De-installation, packing and cross-border shipping
- Move-in installation and process tuning
- Chamber maintenance and consumables planning
- Etch process technology transfer
- Operator and maintenance staff training
AI INTEGRATION
AI integration
The third-party frontier architectures BETTER benchmarks and deploys.
TSMC smart manufacturing: RNN time-series FDC + federated learning
Tool sensor time series predict yield-impacting defects, with cross-fab collaboration and no raw data sharing.
Benchmark architecture
Endpoint detection models
Spectral and time-series signals determine the etch endpoint, suppressing over-etch and under-etch.
Benchmark architecture
USE CASES
Where it fits
- Lines with tighter critical dimension control targets
- Compound semiconductor and advanced packaging etch needs
- Fabs rebuilding etch conditions after a relocation
- Research institutes building etch capability
GET IN TOUCH
Let's talk about your line
One point of contact from equipment selection through installation and AI integration.